US 10,892,072 B1
PTC device
Chun-Teng Tseng, Miaoli County (TW); Yao-Te Chang, Yunlin County (TW); and Wen Feng Lee, Taoyuan (TW)
Assigned to POLYTRONICS TECHNOLOGY CORP., Hsinchu (TW)
Filed by Polytronics Technology Corp., Hsinchu (TW)
Filed on Apr. 9, 2020, as Appl. No. 16/844,585.
Claims priority of application No. 108129030 A (TW), filed on Aug. 15, 2019.
Int. Cl. H01C 7/02 (2006.01); H01C 1/14 (2006.01)
CPC H01C 7/027 (2013.01) [H01C 1/1406 (2013.01); H01C 7/021 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A PTC device, comprising:
a laminated substrate, comprising a first conductive layer, a second conductive layer and an insulating layer laminated between the first and second conductive layers;
a first PTC material layer disposed on the first conductive layer,
a second PTC material layer disposed on the second conductive layer,
a first metal layer disposed on the first PTC material layer; and
a second metal layer disposed on the second PTC material layer;
wherein the insulating layer has a through hole filled with PTC material to form a PTC connecting member of which one end connects to the first PTC material layer and another end connects to the second PTC material layer.