US 10,890,931 B2
Memory module thermal management
Ishmael Santos, Milpitas, CA (US); Corinne Hall, Hillsboro, OR (US); and Christopher Cox, Placerville, CA (US)
Assigned to INTEL CORPORATION, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Oct. 2, 2017, as Appl. No. 15/723,155.
Application 15/723,155 is a continuation of application No. 12/942,091, filed on Nov. 9, 2010, granted, now 9,778,664.
Application 12/942,091 is a continuation of application No. 11/589,622, filed on Oct. 30, 2006, granted, now 7,830,690, issued on Nov. 9, 2010.
Prior Publication US 2018/0120871 A1, May 3, 2018
This patent is subject to a terminal disclaimer.
Int. Cl. G05D 23/19 (2006.01)
CPC G05D 23/19 (2013.01) 19 Claims
OG exemplary drawing
 
1. A method comprising:
implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform, the scheme based on:
a configuration of the memory module to include a thermal sensor to monitor the memory module's temperature; and
thermal information associated with a given memory module with thermal sensor configuration, the thermal information including thermal characteristics, the thermal characteristics to include:
a resolution of the thermal sensor;
an accuracy of the thermal sensor;
a first offset value related to the memory device in a low workload mode;
a second offset value related to the memory device in a high workload mode; and
a theta value related to a given increase in temperature for a given increase in power consumed by the memory device.