US 10,890,850 B2
Optical imaging arrangement with actively adjustable metrology support units
Stefan Hembacher, Bobingen (DE); Bernhard Geuppert, Aalen (DE); and Jens Kugler, Aalen (DE)
Assigned to Carl Zeiss SMT GmbH, Oberkochen (DE)
Filed by Carl Zeiss SMT GmbH, Oberkochen (DE)
Filed on May 24, 2018, as Appl. No. 15/988,113.
Application 15/988,113 is a continuation of application No. PCT/EP2015/078548, filed on Dec. 3, 2015.
Prior Publication US 2018/0275527 A1, Sep. 27, 2018
Int. Cl. G03F 7/20 (2006.01)
CPC G03F 7/70266 (2013.01) [G03F 7/709 (2013.01); G03F 7/70258 (2013.01); G03F 7/70308 (2013.01); G03F 7/70825 (2013.01); G03F 7/70883 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An optical imaging arrangement, comprising:
an optical projection system;
a support structure system; and
a control device,
wherein:
the optical projection system comprises a group of optical elements supported by the support structure system;
the group of optical elements is configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask onto a substrate;
the group of optical elements comprises first and second optical elements;
the control device comprises a sensor device and an active device;
the sensor device comprises a sensor unit configured to capture mechanical disturbance information representative of a mechanical disturbance acting on the first optical element in at least one degree of freedom;
the control device is configured to control the active device based on the mechanical disturbance information and a stored numerical model so that the active device acts on at least the second optical element to at least partially correct an optical imaging error of the optical imaging arrangement during the exposure process resulting from the mechanical disturbance acting on the first optical element;
the stored numerical model is representative of an imaging error alteration of the imaging error in response to the mechanical disturbance captured by the sensor device;
the sensor unit is mechanically connected to an optical imaging arrangement component of the optical imaging arrangement at a sensor location;
a disturbance path exists, along which the mechanical disturbance propagates fastest towards the first optical element;
the sensor location is on the disturbance path;
the mechanical disturbance, along the disturbance path, has a disturbance runtime from the sensor location to the first optical element;
the control device has a control reaction time from capturing the mechanical disturbance information to acting on at least the second optical element to at least partially correct the imaging error;
the sensor location is located, along the disturbance path, at a sensor location distance from the first optical element; and
the sensor location distance is selected such that the control reaction time is smaller than or equal to the disturbance runtime, and
wherein at least one of the following holds:
the active device comprises an active support unit of the support structure system, the active support unit supports the second optical element, and the active support unit is configured to adjust a deformation of the second optical element in at least one degree of freedom; and
the active device comprises an active deformation device assigned to the second optical element, and the active deformation device is configured to adjust a deformation of the second optical element in at least one degree of freedom.