US 10,889,112 B2
Liquid ejection head and manufacturing method thereof
Kousuke Kubo, Kawasaki (JP); and Koichi Omata, Kawasaki (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Feb. 6, 2019, as Appl. No. 16/268,950.
Claims priority of application No. 2018-026778 (JP), filed on Feb. 19, 2018.
Prior Publication US 2019/0255849 A1, Aug. 22, 2019
Int. Cl. B41J 2/14 (2006.01)
CPC B41J 2/14072 (2013.01) [B41J 2/14088 (2013.01); B41J 2/14112 (2013.01); B41J 2/14129 (2013.01); B41J 2202/20 (2013.01); B41J 2202/21 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A liquid ejection head comprising:
a plurality of element substrates including a first element substrate and a second element substrate, each of the first element substrate and the second element substrate having a heating element array in which a plurality of heating elements producing heat energy for liquid ejection by energization is arrayed, an electrically conductive protection layer covering the plurality of heating elements, an insulating layer arranged between the plurality of heating elements and the electrically conductive protection layer, and a connecting terminal for connecting to the outside;
a first flexible wiring substrate including a first wiring electrically connected with the conductive protection layer of the first element substrate via the connecting terminal of the first element substrate;
a second flexible wiring substrate including a second wiring electrically connected with the conductive protection layer of the second element substrate via the connecting terminal of the second element substrate; and
an electrical wiring substrate including a common wiring electrically connected with the first wiring and the second wiring.