US D1,056,861 S
Power semiconductor module
Yuki Nakano, Kyoto (JP); Kenji Yamamoto, Kyoto (JP); and Yasunori Kutsuma, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Sep. 20, 2021, as Appl. No. 29/808,482.
Claims priority of application No. 2021-006000 D (JP), filed on Mar. 23, 2021; and application No. 2021-006001 D (JP), filed on Mar. 23, 2021.
Term of patent 15 Years
LOC (15) Cl. 13 - 02
U.S. Cl. D13—182
OG exemplary drawing
 
The ornamental design for a power semiconductor module, as shown and described.