US 12,193,310 B2
Display substrate and manufacturing method thereof, and display device
Liudong Zhu, Beijing (CN); Yiyang Zhang, Beijing (CN); Qun Ma, Beijing (CN); Chenxing Wan, Beijing (CN); Jiahao Guo, Beijing (CN); and Yuqing Yang, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/763,801
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Chengdu (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Apr. 29, 2021, PCT No. PCT/CN2021/091027
§ 371(c)(1), (2) Date Mar. 25, 2022,
PCT Pub. No. WO2022/226899, PCT Pub. Date Nov. 3, 2022.
Prior Publication US 2024/0049570 A1, Feb. 8, 2024
Int. Cl. H10K 59/80 (2023.01); H10K 59/12 (2023.01); H10K 59/40 (2023.01)
CPC H10K 59/873 (2023.02) [H10K 59/1201 (2023.02); H10K 59/40 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A display substrate, having an opening region, a display region at least partially surrounding the opening region, and an opening peripheral region between the opening region and the display region, and comprising a base substrate,
wherein the opening peripheral region comprises a first barrier dam on the base substrate and an insulating protection layer on a side of the first barrier dam away from the base substrate,
the first barrier dam at least partially surrounds the opening region, the insulating protection layer comprises at least one first material removal region, and a projection of the first material removal region on the base substrate is overlapped with a projection of the first barrier dam on the base substrate; in the at least one first material removal region, a material of the insulating protection layer is at least partially removed, to form a recess portion in the insulating protection layer or a through hole penetrating the insulating protection layer.