CPC H10K 59/1315 (2023.02) | 20 Claims |
1. A conductive pattern comprising:
a conductive layer including aluminum;
a first capping layer disposed on the conductive layer and including titanium; and
a second capping layer disposed on the first capping layer and including titanium nitride,
wherein a mixed region in which the aluminum and the titanium are mixed with each other is disposed in at least portions of the conductive layer and the first capping layer.
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