US 12,193,254 B2
Quantum dot light-emitting device, manufacturing method and display device
Wenhai Mei, Beijing (CN); Zhenqi Zhang, Beijing (CN); and Aidi Zhang, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
Filed on Nov. 3, 2023, as Appl. No. 18/501,065.
Application 18/501,065 is a continuation of application No. 16/982,063, granted, now 11,903,230, previously published as PCT/CN2020/082134, filed on Mar. 30, 2020.
Claims priority of application No. 201910473116.X (CN), filed on May 31, 2019.
Prior Publication US 2024/0065019 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 50/16 (2023.01); H10K 71/00 (2023.01); H10K 85/00 (2023.01); H10K 85/40 (2023.01); G03F 7/16 (2006.01); H10K 50/115 (2023.01); H10K 102/00 (2023.01)
CPC H10K 50/16 (2023.02) [H10K 71/00 (2023.02); H10K 85/40 (2023.02); H10K 85/761 (2023.02); G03F 7/162 (2013.01); G03F 7/168 (2013.01); H10K 50/115 (2023.02); H10K 2102/321 (2023.02)] 12 Claims
OG exemplary drawing
 
1. A quantum dot light-emitting device, comprising:
a cathode and an electron transport layer arranged on one side of the cathode, wherein the electron transport layer comprises a plurality of pixel regions;
an adhesive layer arranged on one side of the electron transport layer, away from the cathode; and
a quantum dot film layer arranged on one side of the adhesive layer, away from the electron transport layer, wherein both the quantum dot film layer and the adhesive layer are located in the pixel regions; wherein
the adhesive layer is respectively connected to the electron transport layer and the quantum dot film layer through at least one of chemical bonding and physical entanglement.