providing a substrate, an array region located above the substrate, wherein the array region comprises a first semiconductor structure and a first dielectric layer that covers a surface of the first semiconductor structure, the first semiconductor structure comprises a capacitor array and a conductive covering layer that covers the capacitor array, and the first dielectric layer covers a surface of the conductive covering layer;

forming, in the first dielectric layer, a groove exposing the first semiconductor structure, wherein the groove runs through the first dielectric layer along a direction parallel to a surface of the substrate, the groove runs through the first dielectric layer along a direction perpendicular to the substrate and extends into the conductive covering layer; and

filling the groove with a conductive material to form an array contact line.