US 12,193,203 B2
Damping film and process for producing a damping film
Thomas Wentzlik, Frankfurt Main (DE)
Assigned to Magnetec GmbH, Hanau (DE)
Appl. No. 18/288,232
Filed by Magnetec GmbH, Hanau (DE)
PCT Filed Apr. 29, 2022, PCT No. PCT/EP2022/061497
§ 371(c)(1), (2) Date Oct. 25, 2023,
PCT Pub. No. WO2022/229393, PCT Pub. Date Nov. 3, 2022.
Claims priority of application No. 102021111286.9 (DE), filed on Apr. 30, 2021.
Prior Publication US 2024/0244809 A1, Jul. 18, 2024
Int. Cl. H05K 9/00 (2006.01)
CPC H05K 9/0086 (2013.01) [H05K 9/0075 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A damping film for shielding an electronic device from an electrical and/or magnetic field comprising:
a first carrier layer;
a first adhesion layer which is in direct contact with the first carrier layer;
a damping layer which is in direct contact with the first adhesion layer, wherein the damping layer comprises a damping material consisting of a magnetically soft substance;
a second adhesion layer which is in direct contact with the damping layer; and
a second carrier layer which is in direct contact with the second adhesion layer,
wherein
the damping material has a coercivity of less than or equal to 2 A/m.