CPC H05K 7/20936 (2013.01) [H02M 7/003 (2013.01); H05K 7/20909 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a 1st bus bar comprising a 1st channel;
a 1st heat-pipe received in the 1st channel and thermally connected to the 1st bus bar;
a 1st dielectric that electrically insulates the 1st heat-pipe from the 1st bus bar;
a 2nd bus bar;
a 2nd heat-pipe thermally connected to the 2nd bus bar;
a first device comprising:
a 1st metal structure comprising 1st and 2nd surfaces, wherein the 1st and 2nd Surfaces of the 1st metal structure are electrically connected, substantially flat and oppositely facing;
a 1st metal element comprising 1st and 2nd surfaces, wherein the 1st and 2nd surfaces of the 1st metal element are electrically connected, substantially flat and oppositely facing;
a 1st transistor comprising 1st and 2nd terminals between which 1 ampere or more of electrical current is transmitted when the 1st transistor is activated, wherein the 1st and 2nd terminals comprise st and 2nd surfaces, respectively, wherein the 1st and 2nd surfaces of the 1st and 2nd terminals, respectively, are substantially flat and oppositely facing;
wherein the 1st and 2nd surfaces of the 1st and 2nd terminals, respectively, are electrically and thermally connected to the 1st and 2nd surfaces, respectively, of the 1st metal structure and the 1st metal element, respectively;
wherein the 1st and 2nd second surfaces of the 1st metal element and the 1st metal structure, respectively, are electrically and thermally connected to the 2nd and 1st bus bars, respectively.
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