a cold plate top wall attached to a first cold plate side wall and a second cold plate side wall, the first cold plate side wall attached to a cold plate bottom wall and including a coolant inlet, and the second cold plate side wall attached to the cold plate bottom wall and including a coolant outlet;

a substrate positioned on the cold plate top wall, the substrate having a plurality of semiconductor devices positioned on the substrate;

a plurality of bi-metal fins extending from the cold plate top wall towards the cold plate bottom wall;

wherein heat from a semiconductor device of the plurality of semiconductor devices causes a coolant introduced between the cold plate top wall and the cold plate bottom wall to raise temperature of the coolant, which causes a bi-metal fin positioned proximal to the heated semiconductor device to deform and change a flow path of the coolant from the coolant inlet to the coolant outlet; and

a plurality of wall extensions extending from the cold plate bottom wall towards the cold plate top wall, the plurality of wall extensions defining a plurality of lower channels for the coolant; and

wherein each bi-metal fin of the plurality of bi-metal fins includes a side wall portion and a bottom wall portion, with each bi-metal fin extending from the cold plate top wall to define a plurality of adjustable upper channels for the coolant.