US 12,193,172 B2
Electronics housing and assembly method
Tobias Köninger, Bühl (DE); and Michael Bohnert, Kappelrodeck (DE)
Assigned to Schaeffler Technologies AG & Co. KG, Herzogenaurach (DE)
Appl. No. 17/921,394
Filed by Schaeffler Technologies AG & Co. KG, Herzogenaurach (DE)
PCT Filed Mar. 29, 2021, PCT No. PCT/DE2021/100307
§ 371(c)(1), (2) Date Oct. 26, 2022,
PCT Pub. No. WO2021/219157, PCT Pub. Date Nov. 4, 2021.
Claims priority of application No. 102020111438.9 (DE), filed on Apr. 27, 2020.
Prior Publication US 2023/0199978 A1, Jun. 22, 2023
Int. Cl. H05K 5/00 (2006.01); H01R 12/58 (2011.01)
CPC H05K 5/0069 (2013.01) [H01R 12/585 (2013.01); H05K 5/0082 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronics housing, comprising:
a circuit board that is contacted via press-fit connections;
guide pins extending through circuit board through-holes provided in the circuit board;
the guide pins protrude from a first press-fit body that includes at least a first one of the press-fit connections; and
a second press-fit body that includes at least a second one of the press-fit connections is guided onto the guide pins of the first press-fit body on a side of the circuit board facing away from the first press-fit body;
wherein each of the circuit board, the first press-fit body, and the second press-fit body include at least one through hole for receiving at least one fastener, and the at least one fastener secures the circuit board, the first press-fit body, and the second press-fit body to a first housing part.