US 12,193,166 B2
Printed circuit board having a sacrificial pad to mitigate galvanic corrosion
Songtao Lu, Shanghai (CN); Hsiang Ju Huang, Taichung (TW); Binbin Zheng, Shanghai (CN); Cheng-Hsiung Yang, Taiwan (TW); and Chien-Te Chen, Taichung (TW)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Apr. 13, 2022, as Appl. No. 17/719,815.
Prior Publication US 2023/0337372 A1, Oct. 19, 2023
Int. Cl. H05K 3/28 (2006.01); H05K 1/09 (2006.01)
CPC H05K 3/282 (2013.01) [H05K 1/09 (2013.01); H05K 2203/0591 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A Printed Circuit Board (PCB) that mitigates galvanic corrosion during an Organic Solderability Preservative (OSP) process used during fabrication of the PCB, comprising:
a first metal pattern and a second metal pattern electrically coupled to each other, wherein the first metal pattern and the second metal pattern comprise different metals;
wherein the first metal pattern has a first area that is exposed by a solder mask layer;
wherein the second metal pattern has a second area that is exposed by the solder mask layer; and
wherein a ratio of the first area to the second area is less than a threshold ratio to mitigate the galvanic corrosion of the second metal pattern exposed on the PCB during the OSP process.