US 12,193,163 B2
Mounting head, mounting apparatus, and method of manufacturing electronic device
Yusuke Takechi, Osaka (JP); and Ryo Fujita, Hyogo (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Jun. 1, 2022, as Appl. No. 17/804,856.
Claims priority of application No. 2021-101833 (JP), filed on Jun. 18, 2021.
Prior Publication US 2022/0408621 A1, Dec. 22, 2022
Int. Cl. H01F 7/06 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01)
CPC H05K 13/0812 (2018.08) [H05K 13/0406 (2018.08); H05K 13/046 (2013.01); H05K 13/0815 (2018.08)] 7 Claims
OG exemplary drawing
 
1. A mounting head configured to mount an electronic component on a board, the mounting head comprising:
a drive part that moves in a vertical direction to apply a load to the electronic component;
a float part supported by the drive part in a vertically movable manner;
a linear motor that applies a vertical upward pressing force to the float part; and
a mounting tool that is fixed on the float part and holds the electronic component,
wherein
the linear motor includes a stator fixed on the drive part and a moving member fixed on the float part,
the drive part moves downward in the vertical direction to apply the load due to an own weight of the float part to the electronic component to mount the electronic component onto the board,
the linear motor is driven to control a magnitude of the load applied to the electronic component by applying the vertical upward pressing force to the float part,
wherein the linear motor is configured to not apply the vertical upward pressing force to the float part when the mounting head is in a standby state, and
wherein the linear motor is configured to start to apply the vertical upward pressing force to the float part before the load due to the own weight of the float part is applied to the electronic component.