| CPC H05K 1/181 (2013.01) [H05K 1/113 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10734 (2013.01)] | 20 Claims |
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1. A module comprising:
a substrate having a first surface;
a first component mounted on the first surface;
a resin film covering the first component along a shape of the first component, and also covering a part of the first surface;
a first conductor film covering at least a part of the resin film along the shape of the first component, and also covering at least a part of a portion in which the resin film covers the part of the first surface; and
a conductor structure disposed to extend over a part of the resin film at a location where the first conductor film covers the first surface with the resin film being interposed therebetween, wherein
the conductor structure includes a first end portion, a second end portion, and an intermediate portion connecting the first end portion and the second end portion,
the first end portion is connected to the first surface,
the second end portion is also connected to the first surface, and
the intermediate portion is in contact with the first conductor film.
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