US 12,193,160 B2
Printed circuit board
Jung Hyun Cho, Suwon-si (KR); Jin Won Lee, Suwon-si (KR); Byung Kuk Kang, Suwon-si (KR); and Chang Soo Woo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 9, 2021, as Appl. No. 17/196,645.
Claims priority of application No. 10-2020-0155770 (KR), filed on Nov. 19, 2020.
Prior Publication US 2022/0159839 A1, May 19, 2022
Int. Cl. H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/30 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01)
CPC H05K 1/165 (2013.01) [H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 27/306 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a core substrate including a plurality of core layers with a cavity disposed therein and first and second core insulating layers respectively extending on and below the plurality of core layers to cover the cavity;
a plurality of magnetic members embedded in the cavity;
a first coil pattern disposed on the first core insulating layer of the core substrate; and
a second coil pattern disposed below the second core insulating layer the core substrate.