CPC H05K 1/144 (2013.01) [H01F 17/0013 (2013.01); H05K 1/05 (2013.01); H05K 1/145 (2013.01); H05K 1/165 (2013.01); H05K 2201/041 (2013.01)] | 11 Claims |
1. A printed circuit board module comprising:
a first printed circuit board;
a second printed circuit board disposed on one surface of the first printed circuit board;
a third printed circuit board disposed on the other surface of the first printed circuit board; and
a core penetrating through the first to the third printed circuit boards,
wherein the second printed circuit board includes a first coil,
wherein the third printed circuit board includes a second coil,
wherein the cross-sectional area of the second printed circuit board and the third printed circuit board is smaller than the cross-sectional area of the first printed circuit board,
wherein the first printed circuit board includes a first hole and a second hole into which a portion of the core is being inserted,
wherein the second printed circuit board is disposed between the first hole and the second hole,
wherein each of the first printed circuit board, the second ted circuit board, and the third printed circuit board includes a hole,
wherein a rivet through the hole,
wherein the first printed circuit board, the second printed circuit board and the third printed circuit board are electrically connected to each other through the rivets, and
wherein at an upper end and a lower end of the river, engaging portions for engaging the second printed circuit board and the third printed circuit board a respectively disposed.
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