a wiring substrate having a first surface;

a plurality of components mounted on the first surface; and

a conductor incorporated resin body mounted on the first surface and that is disposed between the plurality of components,

wherein the conductor incorporated resin body comprises a plurality of resin layers and a conductor pattern that is grounded and that includes a plurality of linear patterns disposed between the plurality of resin layers, such that the respective linear patterns are electrically insulated from each other by the respective resin layers that continuously extend between the respective linear patterns without any electrical interconnects extending between the respective linear patterns.