US 12,193,146 B2
Heater including flexible printed wiring board and method for manufacturing same
Shunsuke Aoyama, Tokyo (JP); and Kenji Kiya, Tokyo (JP)
Assigned to MEKTEC CORPORATION, Tokyo (JP)
Filed by MEKTEC CORPORATION, Tokyo (JP)
Filed on Feb. 8, 2021, as Appl. No. 17/170,265.
Claims priority of application No. 2020-056295 (JP), filed on Mar. 26, 2020.
Prior Publication US 2021/0307155 A1, Sep. 30, 2021
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/36 (2006.01); H05B 1/02 (2006.01); H05B 3/84 (2006.01)
CPC H05K 1/0212 (2013.01) [H05K 1/0393 (2013.01); H05K 3/363 (2013.01); H05B 1/0236 (2013.01); H05B 3/84 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A heater comprising:
a flexible printed wiring board including a base film and a metal foil provided on one side of the base film;
a heater circuit portion that is formed from the metal foil and generates heat when energized; and
a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state;
wherein the heater circuit portion includes a heater wire that meanders in repeating patterns arranged in several adjacent rows, each row comprising a plurality of the repeating patterns; and
wherein the heat conductive foil portion is disposed between the rows or between adjacent ones of the repeating patterns.