| CPC H05K 1/0204 (2013.01) [H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 2201/0376 (2013.01)] | 20 Claims |
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16. A module comprising:
a substrate having a first main surface and a second main surface that opposes the first main surface;
an electronic component disposed on the first main surface;
a plurality of first connection terminals disposed on the second main surface;
a second connection terminal disposed on the second main surface and establishes an electrical connection between the electronic component and a terminal of a motherboard when the module is mounted thereto; and
a sealing resin disposed on the second main surface that exposes each of the first connection terminals and the second connection terminal from the module and opposite to the second main surface of the substrate,
wherein the second connection terminal has surface area opposite the second main surface that is larger than a surface area of each of the first connection terminals opposite the second main surface, and
wherein the second connection terminal does not overlap each of the plurality of first connection terminals on the second main surface in a direction perpendicular to the second main surface.
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