| CPC H05K 1/0203 (2013.01) [G06F 1/206 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01); H01L 25/162 (2013.01); H05K 1/144 (2013.01); H05K 7/2039 (2013.01); H05K 7/209 (2013.01); H05K 2201/042 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10378 (2013.01)] | 20 Claims |
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1. A circuit board module comprising:
a first circuit board that has a first main surface on which a power semiconductor device is mounted and a second main surface and that configures a power conversion circuit; and
a second circuit board having a third main surface and a fourth main surface on which is mounted a load that is configured to receive a current supplied by the power conversion circuit and is electrically connected to the fourth main surface,
wherein
the first circuit board includes a positive output pin of the power conversion circuit and a negative output pin of the power conversion circuit, each of which has a shape projecting from the second main surface,
the second circuit board has a positive through via and a negative through via, each of which has a shape extending between the third main surface and the fourth main surface,
the second main surface of the first circuit board and the third main surface of the second circuit board are physically in proximate contact with each other,
the positive output pin is inserted through the positive through via in such a manner as to reach the fourth main surface,
the negative output pin is inserted through the negative through via in such a manner as to reach the fourth main surface, and
the load is configured to receive the current supplied from the power conversion circuit through the positive output pin and the negative output pin.
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