| CPC H04R 19/04 (2013.01) [H04R 2201/003 (2013.01)] | 20 Claims |
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1. A microelectromechanical system (MEMS) microphone comprising:
a MEMS microphone die;
an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and
an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
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