US 12,191,921 B2
Two dimensional gain calibration for analog component
Anton Radionov, Plainsboro, NJ (US); Daniel James Flaccavento, Pittstown, NJ (US); Joel Taylor Garrell, Morristown, NJ (US); and Herbert Eric Petrat, Bethlehem, PA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Apr. 13, 2022, as Appl. No. 17/659,106.
Claims priority of provisional application 63/201,171, filed on Apr. 15, 2021.
Prior Publication US 2022/0337324 A1, Oct. 20, 2022
Int. Cl. H04B 17/13 (2015.01)
CPC H04B 17/13 (2015.01) 30 Claims
OG exemplary drawing
 
1. A device for wireless communication, comprising:
a memory; and
one or more processors, coupled to the memory, configured to:
identify, for a set of frequency values and a set of temperature values, a set of characterization gain values associated with an analog component, wherein a characterization gain value, of the set of characterization gain values, identifies a gain value corresponding to a frequency value of the set of frequency values and a temperature value of the set of temperature values;
determine a frequency contribution based at least in part on comparing a first observed gain associated with a reference frequency of the set of frequency values and a second observed gain associated with a target frequency,
wherein the first observed gain and the second observed gain are dependent on an operating temperature of the analog component;
determine a temperature contribution based at least in part on comparing a first characterization gain value, of the set of characterization gain values, associated with a reference temperature of the set of temperature values, and a second characterization gain value, of the characterization gain values, associated with a target temperature;
determine a gain offset for the target temperature and the target frequency based at least in part on combining the frequency contribution and the temperature contribution; and
configure the gain offset, associated with the target temperature and the target frequency, for the analog component.