US 12,191,838 B2
Solidly-mounted transversely-excited film bulk acoustic device and method
Ventsislav Yantchev, Sofia (BG); Bryant Garcia, Mississauga (CA); Viktor Plesski, Gorgier (CH); Soumya Yandrapalli, Lausanne (CH); Robert B. Hammond, Santa Barbara, CA (US); Patrick Turner, San Bruno, CA (US); and Jesson John, Dublin, CA (US)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Nov. 7, 2021, as Appl. No. 17/520,688.
Application 17/361,046 is a division of application No. 16/841,134, filed on Apr. 6, 2020, granted, now 10,819,309, issued on Oct. 27, 2020.
Application 17/520,688 is a continuation in part of application No. 17/361,046, filed on Jun. 28, 2021, granted, now 12,088,272.
Application 17/520,688 is a continuation in part of application No. 16/998,300, filed on Aug. 20, 2020.
Application 17/361,046 is a continuation of application No. 16/779,306, filed on Jan. 31, 2020, granted, now 11,165,407, issued on Nov. 2, 2021.
Application 16/779,306 is a continuation of application No. 16/438,141, filed on Jun. 11, 2019, granted, now 10,601,392, issued on Mar. 24, 2020.
Application 16/438,141 is a continuation in part of application No. 16/230,443, filed on Dec. 21, 2018, granted, now 10,491,192, issued on Nov. 26, 2019.
Claims priority of provisional application 62/904,416, filed on Sep. 23, 2019.
Claims priority of provisional application 62/881,749, filed on Aug. 1, 2019.
Claims priority of provisional application 62/830,258, filed on Apr. 5, 2019.
Claims priority of provisional application 62/818,564, filed on Mar. 14, 2019.
Claims priority of provisional application 62/753,815, filed on Oct. 31, 2018.
Claims priority of provisional application 62/753,809, filed on Oct. 31, 2018.
Claims priority of provisional application 62/748,883, filed on Oct. 22, 2018.
Claims priority of provisional application 62/741,702, filed on Oct. 5, 2018.
Claims priority of provisional application 62/701,363, filed on Jul. 20, 2018.
Claims priority of provisional application 62/685,825, filed on Jun. 15, 2018.
Prior Publication US 2022/0376669 A1, Nov. 24, 2022
Int. Cl. H03H 9/02 (2006.01); H03H 3/02 (2006.01); H03H 3/08 (2006.01); H03H 9/13 (2006.01); H03H 9/145 (2006.01); H03H 9/17 (2006.01); H03H 9/25 (2006.01); H03H 9/56 (2006.01)
CPC H03H 9/02228 (2013.01) [H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/02031 (2013.01); H03H 9/02637 (2013.01); H03H 9/132 (2013.01); H03H 9/145 (2013.01); H03H 9/175 (2013.01); H03H 9/176 (2013.01); H03H 9/25 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H03H 9/568 (2013.01); H03H 2003/025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating an acoustic resonator device, the method comprising:
fabricating a bulk acoustic resonator chip comprising:
forming a first conductor pattern on a front surface of a piezoelectric layer, the first conductor pattern comprising a first plurality of contact pads and an interdigital transducer (IDT), the IDT and the piezoelectric layer configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the piezoelectric layer; and
forming an acoustic Bragg reflector between a surface of a substrate and a back surface of the piezoelectric layer, the acoustic Bragg reflector configured to reflect the shear primary acoustic mode;
fabricating an interposer comprising:
forming a second conductor pattern on a surface of the interposer that faces the bulk acoustic resonator chip, the second conductor pattern comprising a second plurality of contact pads;
forming gold bumps by thermocompression or ultrasonic bonding to connect each contact pad of the first plurality of contact pads to a respective contact pad of the second plurality of contact pads; and
forming a polymer cover that is cast over the bulk acoustic resonator chip to seal a space between the bulk acoustic resonator chip and the interposer.