US 12,191,837 B2
Solidly-mounted transversely-excited film bulk acoustic device
Ventsislav Yantchev, Sofia (BG); Bryant Garcia, Mississauga (CA); Viktor Plesski, Gorgier (CH); Soumya Yandrapalli, Lausanne (CH); Robert B. Hammond, Santa Barbara, CA (US); Patrick Turner, San Bruno, CA (US); and Jesson John, Dublin, CA (US)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Nov. 7, 2021, as Appl. No. 17/520,687.
Application 17/361,046 is a division of application No. 16/841,134, filed on Apr. 6, 2020, granted, now 10,819,309, issued on Oct. 27, 2020.
Application 17/520,687 is a continuation in part of application No. 17/361,046, filed on Jun. 28, 2021, granted, now 12,088,272.
Application 17/520,687 is a continuation in part of application No. 16/998,300, filed on Aug. 20, 2020.
Application 17/361,046 is a continuation of application No. 16/779,306, filed on Jan. 31, 2020, granted, now 11,165,407, issued on Nov. 2, 2021.
Application 16/779,306 is a continuation of application No. 16/438,141, filed on Jun. 11, 2019, granted, now 10,601,392, issued on Mar. 24, 2020.
Application 16/438,141 is a continuation in part of application No. 16/230,443, filed on Dec. 21, 2018, granted, now 10,491,192, issued on Nov. 26, 2019.
Claims priority of provisional application 62/904,416, filed on Sep. 23, 2019.
Claims priority of provisional application 62/881,749, filed on Aug. 1, 2019.
Claims priority of provisional application 62/830,258, filed on Apr. 5, 2019.
Claims priority of provisional application 62/818,564, filed on Mar. 14, 2019.
Claims priority of provisional application 62/753,815, filed on Oct. 31, 2018.
Claims priority of provisional application 62/753,809, filed on Oct. 31, 2018.
Claims priority of provisional application 62/748,883, filed on Oct. 22, 2018.
Claims priority of provisional application 62/741,702, filed on Oct. 5, 2018.
Claims priority of provisional application 62/701,363, filed on Jul. 20, 2018.
Claims priority of provisional application 62/685,825, filed on Jun. 15, 2018.
Prior Publication US 2022/0060170 A1, Feb. 24, 2022
Int. Cl. H03H 9/02 (2006.01); H03H 3/02 (2006.01); H03H 9/13 (2006.01); H03H 9/17 (2006.01); H03H 9/56 (2006.01)
CPC H03H 9/02228 (2013.01) [H03H 3/02 (2013.01); H03H 9/02031 (2013.01); H03H 9/132 (2013.01); H03H 9/175 (2013.01); H03H 9/176 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H03H 9/568 (2013.01); H03H 2003/025 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An acoustic resonator device comprising:
an acoustic resonator chip comprising:
a substrate;
a piezoelectric layer having front and back surfaces;
a first conductor pattern on the front surface of the piezoelectric layer, the first conductor pattern comprising a first plurality of contact pads and an interdigital transducer (IDT), the IDT and the piezoelectric layer configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode within the piezoelectric layer; and
an acoustic Bragg reflector between a surface of the substrate and the back surface of the piezoelectric layer, the acoustic Bragg reflector configured to reflect the shear primary acoustic mode;
an interposer comprising a second conductor pattern that includes a second plurality of contact pads on a surface of the interposer that faces the acoustic resonator chip; and
a continuous metal seal around a perimeter of the piezoelectric layer and perimeter of the interposer, the continuous metal seal being spaced apart from the first and second plurality of contact pads and configured to seal the IDT in a cavity of the acoustic resonator device,
wherein the interposer comprises a plurality of conductor layers with vias connecting the second plurality of contact pads to a third plurality of contact pads on a surface of the interposer that is not facing the IDT,
wherein each contact pad of the first plurality of contact pads is connected to a respective contact pad of the second plurality of contact pads, and
wherein at least one of the contact pads of the first plurality of contact pads is connected to at least one of the contact pads of the second plurality of contact pads by thermocompression or ultrasonic bonding.