US 12,191,833 B2
Power amplifier self-heating compensation circuit
Tero Tapio Ranta, San Diego, CA (US); Keith Bargroff, San Diego, CA (US); Christopher C. Murphy, Lake Zurich, IL (US); and Robert Mark Englekirk, Littleton, CO (US)
Assigned to pSemi Corporation, San Diego, CA (US)
Filed by pSemi Corporation, San Diego, CA (US)
Filed on Sep. 15, 2022, as Appl. No. 17/945,652.
Application 17/945,652 is a continuation of application No. 17/124,118, filed on Dec. 16, 2020, granted, now 11,451,205.
Application 17/124,118 is a continuation of application No. 16/676,219, filed on Nov. 6, 2019, granted, now 10,873,308, issued on Dec. 22, 2020.
Application 16/676,219 is a continuation of application No. 16/025,873, filed on Jul. 2, 2018, granted, now 10,483,929, issued on Nov. 19, 2019.
Application 16/025,873 is a continuation of application No. 15/445,811, filed on Feb. 28, 2017, granted, now 10,056,874, issued on Aug. 21, 2018.
Prior Publication US 2023/0084770 A1, Mar. 16, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H03F 1/30 (2006.01); H03F 1/56 (2006.01); H03F 3/19 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01); H03G 3/30 (2006.01)
CPC H03G 3/3042 (2013.01) [H03F 1/30 (2013.01); H03F 1/303 (2013.01); H03F 1/304 (2013.01); H03F 1/56 (2013.01); H03F 3/19 (2013.01); H03F 3/21 (2013.01); H03F 3/245 (2013.01); H03G 3/3036 (2013.01); H03F 2200/222 (2013.01); H03F 2200/318 (2013.01); H03F 2200/387 (2013.01); H03F 2200/447 (2013.01); H03F 2200/451 (2013.01); H03F 2200/468 (2013.01); H03G 2201/106 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit including (1) an amplifier having a Gain that droops due to heating of the amplifier during operation, and (2) a temperature compensation circuit, the temperature compensation circuit including:
(a) at least one sensor located with respect to the amplifier so as to measure the temperature of the amplifier and generate an output signal T representing such temperature;
(b) at least one sample and hold circuit, each coupled to at least one sensor through an intermediate amplifier coupled between the at least one sensor and the at least one sample and hold circuit, configured to capture a temperature T(t=t0) at a time t0 after commencement of operation of the amplifier, and to sample a temperature T(t>t0) at times after time to during operation of the amplifier;
(c) a comparison circuit, coupled to at least one sample and hold circuit, for determining a signal ΔT=T(t>t0)−T(t=t0); and
(d) a mapping circuit, coupled to the comparison circuit, for receiving values of the signal ΔT and mapping the values of the signal ΔT to corresponding control signal values, the control signal values being coupled to one or more adjustable circuits on the integrated circuit to adjust one or more circuit parameters of the one or more circuits.