US 12,191,628 B2
Semiconductor light emitting device
Yoshiro Takiguchi, Tokyo (JP); Hisayoshi Motobayashi, Tokyo (JP); Hiroyuki Miyahara, Kumamoto (JP); Masahiro Murayama, Tokyo (JP); and Hidekazu Kawanishi, Tokyo (JP)
Assigned to Sony Group Corporation, Tokyo (JP)
Appl. No. 17/422,351
Filed by Sony Group Corporation, Tokyo (JP)
PCT Filed Dec. 6, 2019, PCT No. PCT/JP2019/047883
§ 371(c)(1), (2) Date Jul. 12, 2021,
PCT Pub. No. WO2020/162023, PCT Pub. Date Aug. 13, 2020.
Claims priority of application No. 2019-018059 (JP), filed on Feb. 4, 2019.
Prior Publication US 2022/0077649 A1, Mar. 10, 2022
Int. Cl. H01S 5/0239 (2021.01); H01S 5/02208 (2021.01); H01S 5/02253 (2021.01); H01S 5/02255 (2021.01); H01S 5/023 (2021.01); H01S 5/02345 (2021.01); H01S 5/323 (2006.01); H01S 5/40 (2006.01)
CPC H01S 5/0239 (2021.01) [H01S 5/02208 (2013.01); H01S 5/02253 (2021.01); H01S 5/02255 (2021.01); H01S 5/023 (2021.01); H01S 5/02345 (2021.01); H01S 5/32341 (2013.01); H01S 5/4093 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor light emitting device comprising:
a light emitting element;
a first housing member and a second housing member at least one of which has a wiring structure, the first housing member and the second housing member housing the light emitting element, the wiring structure electrically coupling the light emitting element and an outside; and
an electrically conductive bonding section that bonds the first housing member and the second housing member, the electrically conductive bonding section being electrically coupled to the wiring structure, wherein
the first housing member includes a first recessed section, a first layer, and a second layer, the first recessed section forming a housing space in which the light emitting element is housed, the first layer being included in a bottom surface of the first recessed section, the second layer being included in a side surface of the first recessed section,
one or more first metal patterns are formed on the first layer,
one or more second metal patterns are formed on the second layer, the one or more second metal patterns being electrically coupled to at least a portion of the one or more first metal patterns,
the second layer includes a bonding layer and an intermediate layer, the bonding layer being bonded to the second housing member, the intermediate layer being disposed between the bonding layer and the first layer,
the one or more second metal patterns are formed on each of the bonding layer and the intermediate layer, and
the one or more second metal patterns formed on the bonding layer include an electrode extraction section, the electrode extraction section being electrically coupled to an electrode of the light emitting element.