US 12,191,571 B2
Antenna with graded dielectirc and method of making the same
Saravana Maruthamuthu, Munich (DE); Bernd Waidhas, Pettendorf (DE); Andreas Augustin, Munich (DE); and Georg Seidemann, Landshut (DE)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on May 18, 2021, as Appl. No. 17/323,278.
Application 17/323,278 is a continuation of application No. 15/892,632, filed on Feb. 9, 2018, granted, now 11,031,699.
Prior Publication US 2021/0273342 A1, Sep. 2, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 19/06 (2006.01); H01L 21/3205 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H01Q 1/48 (2006.01); H01Q 15/08 (2006.01)
CPC H01Q 19/06 (2013.01) [H01L 21/32051 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 23/66 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01Q 1/48 (2013.01); H01Q 15/08 (2013.01); H01L 24/05 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/142 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A package, comprising:
a die;
an antenna over the die; and
a plurality of dielectric layers stacked over the antenna, wherein horizontal dimensions of the plurality of dielectric layers increase along a direction from the antenna towards a top surface of the package.