US 12,191,549 B2
Circuit board, circuit board connection structure, and method of manufacturing circuit board connection structure
Kentarou Kawabe, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Oct. 27, 2022, as Appl. No. 17/974,581.
Application 17/974,581 is a continuation of application No. PCT/JP2021/017818, filed on May 11, 2021.
Claims priority of application No. 2020-084867 (JP), filed on May 14, 2020.
Prior Publication US 2023/0043114 A1, Feb. 9, 2023
Int. Cl. H03H 7/38 (2006.01); H01P 1/04 (2006.01); H01P 3/08 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01)
CPC H01P 1/04 (2013.01) [H01P 3/08 (2013.01); H01P 3/085 (2013.01); H03H 7/38 (2013.01); H05K 1/021 (2013.01); H05K 1/0212 (2013.01); H05K 1/14 (2013.01); H05K 3/4632 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a multilayer body defined by laminated thermoplastic resin layers, the multilayer body including a first main surface on one end in a lamination direction and a second main surface on another end in the lamination direction;
a mounted conductor on the first main surface; and
a planar conductor located closer to the second main surface than the mounted conductor and other conductors provided in the multilayer body; wherein
the multilayer body includes a connection portion joined to an external board via a conductive joint material through use of the mounted conductor, and a circuit portion other than the connection portion;
a first region includes a first opening hole and a second region includes a second opening hole, the first region being a region of the circuit portion of the planar conductor, the second region being a region of the connection portion of the planar conductor; and
a ratio of an opening area of the second opening hole to an area of the second region is larger than a ratio of an opening area of the first opening hole to an area of the first region.