US 12,191,434 B2
Method for making electronic device arrays using a temporary substrate
David Trung Doan, Baoshan Township, Hsinchu County (TW); and Trung Tri Doan, Baoshan Township, Hsinchu County (TW)
Assigned to SemiLEDs Optoelectronics Co., Ltd., Chu-nan (TW)
Filed by SemiLEDS Optoelectronics Co., Ltd., Chu-nan (TW)
Filed on Oct. 9, 2023, as Appl. No. 18/377,872.
Application 18/377,872 is a continuation of application No. 17/676,334, filed on Feb. 21, 2022, granted, now 11,817,536.
Application 18/377,872 is a continuation of application No. 17/078,323, filed on Oct. 23, 2020, granted, now 11,387,397, issued on Jul. 22, 2022.
Application 18/377,872 is a continuation of application No. 16/139,292, filed on Sep. 24, 2018, granted, now 10,910,535, issued on Feb. 21, 2021.
Claims priority of provisional application 62/590,715, filed on Nov. 27, 2017.
Claims priority of provisional application 62/583,018, filed on Nov. 8, 2017.
Prior Publication US 2024/0038958 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/00 (2010.01); H01L 33/52 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/0093 (2020.05); H01L 33/52 (2013.01); H01L 33/0095 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for making electronic device arrays comprising:
providing a plurality of separate electronic devices with at least one of the devices comprising a light emitting diode (LED);
providing a temporary substrate configured as an attaching substrate for the electronic devices;
attaching the electronic devices to the temporary substrate;
forming one or more insulator layers on the electronic devices while attached to the temporary substrate;
forming one or more metal layers configured to electrically connect the electronic devices to form a desired circuitry; and
separating the electronic devices along with the metal layers and the insulator layers from the temporary substrate.