| CPC H01L 33/58 (2013.01) [H01L 33/62 (2013.01); H01L 33/48 (2013.01); H01L 33/60 (2013.01)] | 6 Claims |
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1. A semiconductor device package comprising:
a body including a plurality of cavities separated from each other to be non-overlapped, each of the plurality of cavities including a bottom surface, and a slope surface connected to the bottom surface;
a substrate disposed on the bottom surface of the cavity; and
a plurality of semiconductor devices disposed in one surface of the substrate to be separately inserted into the plurality of cavities and positioned in the body such that only a single one of the semiconductor devices is separately disposed within each of the cavities,
wherein the plurality of cavities are disposed along a plurality of rows that includes a first row and a second row, wherein a first set of the cavities are arranged in the first row, and a second set of the cavities are arranged in the second row,
wherein the body includes:
a plurality of conductive portions disposed in a first direction; and
a plurality of insulation lines disposed in parallel in a second direction crossing the first direction between the plurality of conductive portions to electrically insulate the plurality of conductive portions,
wherein the plurality of insulation lines includes:
a first insulation line passing through a bottom surface of a second cavity of the first set of the cavities arranged in the first row and passing through a slope surface of a second cavity of the second set of the cavities arranged in the second row; and
a second insulation line passing through a slope surface of a first cavity of the first set of the cavities arranged in the first row and passing through a bottom surface of a first cavity of the second set of the cavities arranged in the second row,
wherein the substrate includes:
a first electrode and a second electrode disposed on one surface of the substrate; and
a first pad, a second pad and a third pad disposed on a lower surface of the substrate;
wherein the first pad is electrically connected to the first electrode, the second pad is electrically connected to the second electrode, and the third pad disposed between the first pad and the second pad is a heat dissipation pad.
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