US 12,191,397 B2
Semiconductor device
Akihiro Hanada, Tokyo (JP); Hajime Watakabe, Tokyo (JP); Takuo Kaitoh, Tokyo (JP); and Ryo Onodera, Tokyo (JP)
Assigned to Japan Display Inc., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Nov. 9, 2021, as Appl. No. 17/522,258.
Claims priority of application No. 2020-199913 (JP), filed on Dec. 1, 2020.
Prior Publication US 2022/0173247 A1, Jun. 2, 2022
Int. Cl. H01L 29/786 (2006.01)
CPC H01L 29/7869 (2013.01) [H01L 29/78618 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A semiconductor device including a thin-film transistor, the thin-film transistor comprising:
an oxide semiconductor layer;
a gate insulating layer;
a gate electrode overlapped on the oxide semiconductor layer through the gate insulating layer;
a source electrode in contact with the oxide semiconductor layer;
a drain electrode in contact with the oxide semiconductor layer; and
a first metal layer in contact with the oxide semiconductor layer and disposed between the source electrode and the drain electrode at a distance from the source electrode and the drain electrode, wherein
the oxide semiconductor layer includes a channel region and a low resistance region, the low resistance region overlaps the first metal layer, and
an oxygen concentration of the low resistance region is lower than the oxygen concentration of the channel region.