US 12,191,337 B2
Imaging unit, method for manufacturing the same, and electronic apparatus
Kenya Nishio, Kanagawa (JP); and Suguru Saito, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Nov. 30, 2022, as Appl. No. 18/060,216.
Application 18/060,216 is a continuation of application No. 17/044,460, granted, now 11,538,843, previously published as PCT/JP2019/008589, filed on Mar. 5, 2019.
Claims priority of application No. 2018-074755 (JP), filed on Apr. 9, 2018.
Prior Publication US 2023/0107566 A1, Apr. 6, 2023
Int. Cl. H01L 27/146 (2006.01); H01L 23/00 (2006.01)
CPC H01L 27/14634 (2013.01) [H01L 24/32 (2013.01); H01L 27/14636 (2013.01); H01L 27/1469 (2013.01); H01L 2224/32145 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
an upper section that includes a plurality of pixels; and
a lower section that includes a logic chip, a memory chip, and an organic insulating layer, wherein
the logic chip is bonded and electrically connected to the upper section,
the memory chip is bonded and electrically connected to the upper section, and
the logic chip and the memory chip are covered by the organic insulating layer.