CPC H01L 25/50 (2013.01) [H01L 25/0756 (2013.01); H01L 33/382 (2013.01); H01L 33/486 (2013.01); H01L 33/501 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H05K 1/0203 (2013.01); H05K 1/0306 (2013.01); H05K 2201/10106 (2013.01)] | 20 Claims |
1. A method of forming a solid state light (SSL), comprising:
providing a carrier substrate having a first electrically insulative material at a first surface of the carrier substrate, a second electrically insulative material at a second surface opposite the first surface, and a through substrate interconnect (TSI) extending from the first surface to the second surface;
disposing a first reflective material in direct contact with the first electrically insulative material;
mounting a first solid state emitter (SSE) over the first reflective material and electrically coupling the first SSE to the TSI;
disposing a second reflective material in direct contact with the second electrically insulative material; and
mounting a second SSE over the second reflective material and electrically coupling the second SSE to the TSI.
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