	US 12,191,288 B2
	Integrated voltage regulator (IVR) package including inductor and capacitor and IVR system package including the IVR package
Sangnam Jeong, Hwaseong-si (KR); and Yunhee Lee, Seongnam-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 17, 2022, as Appl. No. 17/947,113.
Claims priority of application No. 10-2022-0016975 (KR), filed on Feb. 9, 2022.
Prior Publication US 2023/0253381 A1, Aug. 10, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)

CPC H01L 25/16 (2013.01) [H01L 23/49833 (2013.01); H01L 25/162 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06565 (2013.01)]

20 Claims

1. An integrated voltage regulator (IVR) package comprising:

a package substrate;

a stacked structure mounted on the package substrate and having a stack structure in which a passive device chip comprising one or more capacitors and an IVR chip including a voltage regulator are stacked; and

an intermediate substrate disposed on the package substrate and having a structure surrounding the stacked structure, the intermediate substrate including vias therein,

wherein one or more inductors are included in the intermediate substrate.