| CPC H01L 25/0657 (2013.01) [H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01)] | 19 Claims |
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1. A semiconductor device assembly, comprising:
a substrate including a first plurality of external contacts at a lowermost surface of the substrate;
an interposer having a length and a width each less than both a length and a width of the substrate, the interposer having a plurality of inner contacts on a first side and having a second plurality of external contacts on a second side opposite the first side, the interposer coupled to the lowermost surface of the substrate at least in part by one or more of the plurality of inner contacts;
a die disposed between the lowermost surface of the substrate and the first side of the interposer;
a first plurality of solder balls disposed on corresponding ones of the first plurality of external contacts; and
a second plurality of solder balls disposed on corresponding ones of the second plurality of external contacts,
wherein the first plurality of solder balls and the second plurality of solder balls are configured to bond with co-planar package contacts.
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