US 12,191,276 B2
Mounting apparatus
Alexander Dzhangirov, Tokyo (JP); and Kohei Seyama, Tokyo (JP)
Assigned to SHINKAWA LTD., Tokyo (JP)
Appl. No. 17/642,948
Filed by SHINKAWA LTD., Tokyo (JP)
PCT Filed Jul. 16, 2020, PCT No. PCT/JP2020/027600
§ 371(c)(1), (2) Date Mar. 14, 2022,
PCT Pub. No. WO2022/013995, PCT Pub. Date Jan. 20, 2022.
Prior Publication US 2022/0415845 A1, Dec. 29, 2022
Int. Cl. B32B 41/00 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 2224/75301 (2013.01); H01L 2224/75611 (2013.01); H01L 2224/75824 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A mounting apparatus pressing a semiconductor chip arranged on a mounted body, the mounting apparatus comprising:
a bonding stage, holding the mounted body on which the semiconductor chip is arranged;
a base stand, supporting the bonding stage;
a mounting head, moving in a contacting/separating direction with respect to the mounted body and to which a pressing tool that presses the semiconductor chip on the mounted body is mounted on the tip; and
a film arranging mechanism, provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip and the pressing tool,
wherein the film arranging mechanism comprises:
film guides guiding the cover film, the film guide comprising a contact portion that contacts the bonding stage and defining a height of the cover film with respect to the bonding stage; and
lifting mechanisms, connected to the film guides via elastic members and lifting and lowering the film guides with respect to the bonding stage, wherein the lifting mechanism comprises a guide rail, sharing a base with the film arrangement mechanism in order that the lifting mechanism is able to move in an up-and-down direction along the guide rail affecting the height of the cover film with respect to the bonding stage.