US 12,191,273 B2
Pre-molded leadframes in semiconductor devices
Sreenivasan K. Koduri, Allen, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Mar. 23, 2021, as Appl. No. 17/210,380.
Application 17/210,380 is a continuation of application No. 16/151,026, filed on Oct. 3, 2018, granted, now 10,957,666.
Claims priority of provisional application 62/568,333, filed on Oct. 5, 2017.
Claims priority of provisional application 62/568,331, filed on Oct. 5, 2017.
Claims priority of provisional application 62/568,330, filed on Oct. 5, 2017.
Prior Publication US 2021/0210453 A1, Jul. 8, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01)
CPC H01L 24/16 (2013.01) [H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/3157 (2013.01); H01L 23/495 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49558 (2013.01); H01L 23/49586 (2013.01); H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 23/4951 (2013.01); H01L 23/49562 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/1111 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17515 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/014 (2013.01); H01L 2924/3656 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a semiconductor die including a plurality of bumps electrically connected to the semiconductor die;
a portion of a leadframe attached to the plurality of bumps, wherein the leadframe includes a first side and a second side opposing the first side, a first plurality of openings extending into the leadframe from the first side, and a second plurality of openings extending into the leadframe from the second side, the first plurality of openings including a first lateral width and the second plurality of openings including a second lateral width, wherein the second lateral width is greater than the first lateral width;
a first molding compound covering portions of the semiconductor die, the plurality of bumps and filling the first plurality of openings; and
a second molding compound filling the second plurality of openings; wherein each of the first plurality of openings is nonlinear in shape when viewed from a top view of the semiconductor package.