	US 12,191,265 B2
	Antenna apparatus and method
Feng-Wei Kuo, Zhudong Township (TW); and Wen-Shiang Liao, Toufen Township (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 7, 2023, as Appl. No. 18/366,282.
Application 18/366,282 is a division of application No. 17/314,368, filed on May 7, 2021, granted, now 11,961,809.
Claims priority of provisional application 63/154,034, filed on Feb. 26, 2021.
Prior Publication US 2023/0387049 A1, Nov. 30, 2023
Int. Cl. H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01)

CPC H01L 23/66 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01)]

20 Claims

1. A method comprising:

bonding a first die to a second die, wherein bonding the first die to the second die comprises bonding a feed line and first conductive pad of the second die to second conductive pads of the first die;

depositing an insulating material to surround the first die;

etching first openings in the insulating material to expose a third conductive pad of the second die, and etching a second opening in the insulating material to expose the feed line; and

depositing a conductive material in the first openings and the second opening to form a plurality of first conductive pillars in the first openings and a first conductive plate in the second opening.