a leadframe including a plurality of leads and a first die pad, a second die pad, and a third die pad;

a transmitter die attached to the first die pad, the transmitter die including first circuitry electrically connected to bond pads on the transmitter die including a first transmitter signal bond pad and a second transmitter signal bond pad;

a first receiver die attached to the second die pad, the first receiver die including second circuitry electrically connected to bond pads on the first receiver die including a first receiver signal bond pad;

a second receiver die attached to the third die pad, the second receiver including third circuitry electrically connected to bond pads on the second receiver including a second receiver signal bond pad;

a first bond wire between the first transmitter signal bond pad and the first receiver signal bond pad, and a second bond wire between the second transmitter bond pad and the second receiver signal bond pad;

a first ring shield and a second ring shield on the transmitter die positioned around the first and the second transmitter signal bond pads, respectively, a third ring shield on the first receiver die positioned around the first receiver signal bond pad, and a fourth ring shield on the second receiver die positioned around the second receiver signal bond pad;

a downbond from the third ring shield to the second die pad, and from the fourth ring shield to the third die pad;

a connection electrically connecting the first and second transmitter ring shields to at least one ground pin selected from the plurality of leads;

wherein the second die pad and the third die pad each include a direct integral connection to the ground pin.