CPC H01L 23/5226 (2013.01) [H01L 23/5283 (2013.01); H01L 23/53266 (2013.01); H01L 23/53271 (2013.01); H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 41/40 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02); G11C 16/0483 (2013.01)] | 24 Claims |
1. A microelectronic device, comprising:
a stack structure overlying a source tier, the stack structure comprising a vertically alternating sequence of conductive structures and insulative structures arranged in tiers;
a staircase structure within the stack structure and having steps comprising lateral edges of the tiers;
support structures vertically extending through the stack structure and within a horizontal area of the staircase structure;
conductive contacts vertically extending through the stack structure and horizontally neighboring the support structures within the horizontal area of the staircase structure, each of the conductive contacts having a horizontally projecting portion in contact with one of the conductive structures of the stack structure at one of the steps of the staircase structure; and
dielectric-filled trenches dividing the stack structure into multiple blocks individually including some of the conductive contacts and some of the support structures within horizontal boundaries of the blocks.
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