US 12,191,241 B2
Fine pitch copper pillar package and method
Robert Francis Darveaux, Gilbert, AZ (US); David McCann, Chandler, AZ (US); John McCormick, Chandler, AZ (US); and Louis W. Nicholls, Gilbert, AZ (US)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Aug. 9, 2021, as Appl. No. 17/397,259.
Application 17/397,259 is a continuation of application No. 16/571,565, filed on Sep. 16, 2019, granted, now 11,088,064.
Application 16/571,565 is a continuation of application No. 16/276,151, filed on Feb. 14, 2019, granted, now 10,418,318, issued on Sep. 17, 2019.
Application 16/276,151 is a continuation of application No. 15/284,242, filed on Oct. 3, 2016, granted, now 10,224,270, issued on Mar. 5, 2019.
Application 15/284,242 is a continuation of application No. 13/963,635, filed on Aug. 9, 2013, granted, now 9,462,690, issued on Oct. 4, 2016.
Application 13/963,635 is a continuation of application No. 12/414,220, filed on Mar. 30, 2009, granted, now 8,536,458, issued on Sep. 17, 2013.
Prior Publication US 2022/0189866 A1, Jun. 16, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/11 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/563 (2013.01); H01L 23/49894 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H05K 1/111 (2013.01); H05K 3/00 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1412 (2013.01); H01L 2224/14133 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/15311 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0415 (2013.01); Y02P 70/50 (2015.11)] 22 Claims
OG exemplary drawing
 
1. An electronic component assembly comprising:
an electronic component comprising a pad, the pad comprising a longitudinal pad length and a latitudinal pad width; and
a conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width, the conductive pillar having a first end, a second end, and a planar side extending entirely across the latitudinal pillar width between the first end and the second end, the first end coupled to the pad, the second end coupled on a trace via solder, wherein the solder is directly coupled to both the second end of the conductive pillar and the trace without contacting any pads,
wherein:
a latitudinal width of at least a portion of the solder directly between the second end of the conductive pillar and the trace is greater than a latitudinal width of the trace directly coupled to the solder;
the latitudinal pillar width is greater than the latitudinal width of the trace;
the longitudinal pillar length is at least double the latitudinal pillar width of the planar side;
the latitudinal pad width is different from the latitudinal pillar width;
the longitudinal pad length is different from the longitudinal pillar length; and
a majority of the planar side of the conductive pillar is free of solder.