US 12,191,233 B2
Embedded cooling systems and methods of manufacturing embedded cooling systems
Belgacem Haba, Saratoga, CA (US); Thomas Workman, San Jose, CA (US); Cyprian Emeka Uzoh, San Jose, CA (US); Guilian Gao, Campbell, CA (US); and Rajesh Katkar, Milpitas, CA (US)
Assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed by Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US)
Filed on Jul. 28, 2022, as Appl. No. 17/876,376.
Prior Publication US 2024/0038633 A1, Feb. 1, 2024
Int. Cl. H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/32 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/473 (2013.01) [H01L 23/32 (2013.01); H01L 23/467 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/05693 (2013.01); H01L 2224/08245 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/80486 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/04642 (2013.01); H01L 2924/0504 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/0544 (2013.01); H01L 2924/059 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A cooling assembly attached to a singulated device, the cooling assembly comprising:
a cold plate body comprising a first side adjacent to the singulated device and an opposite second side; and
a manifold lid attached to the second side, wherein:
the cold plate body and the singulated device each comprise copper features disposed in respective bonding surfaces;
the cold plate body is attached to the singulated device by direct dielectric-to-dielectric bonds formed between the bonding surface of the first side of the cold plate body and the bonding surface of a backside of the singulated device and by direct metal bonds formed between the copper features;
the cold plate body and the manifold lid define one or more cavities; and
the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.