US 12,191,232 B2
Data storage structure or data infrastructure including a plurality of storage device preliminary class
Ho Sung Kang, Icheon-si (KR)
Assigned to SK HYNIX INC., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Dec. 21, 2022, as Appl. No. 18/069,292.
Claims priority of application No. 10-2022-0109627 (KR), filed on Aug. 31, 2022.
Prior Publication US 2024/0071867 A1, Feb. 29, 2024
Int. Cl. H05K 7/20 (2006.01); H01L 23/467 (2006.01); H10B 80/00 (2023.01)
CPC H01L 23/467 (2013.01) [H05K 7/20127 (2013.01); H05K 7/20745 (2013.01); H05K 7/20836 (2013.01); H10B 80/00 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A storage device, comprising:
a printed circuit board (PCB) with attached semiconductor chips, each including a memory, and with at least one wire coupling the semiconductor chips; and
a breathable case surrounding a top portion and a bottom portion of the printed circuit board and comprising a first layer disposed on a second layer, which is exposed to the printed circuit board, wherein the second layer has smaller pores than the first layer.