US 12,191,229 B2
Semiconductor package with blind hole attachment to heat sink
Ryan Tordillo Comadre, Melaka (MY); Victor Dela Cruz Del Rosario, Melaka (MY); Bernie Tabanao Rosales, Melaka (MY); Subaramaniym Senivasan, Jasin (MY); and Heng Chen Tang, Muar (MY)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Oct. 25, 2021, as Appl. No. 17/509,746.
Prior Publication US 2023/0125452 A1, Apr. 27, 2023
Int. Cl. H01L 23/40 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/4093 (2013.01) [H01L 23/4006 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 24/48 (2013.01); H01L 2224/48245 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a lead frame that comprises a die pad and a plurality of leads;
a semiconductor die mounted on a die attach surface of the die pad;
an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame; and
a fastener receptacle that comprises a blind hole in the encapsulant body or the die pad, and
wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.
 
13. A semiconductor assembly comprising:
a heat sink;
a semiconductor package comprising an encapsulant body of electrically insulating material, a die pad with a rear surface that is exposed from a first main face of the encapsulant body, and a fastener receptacle that comprises a blind hole in the encapsulant body or the die pad; and
a fastener that is securely retained by the fastener receptacle and affixes the semiconductor package to the heat sink.