US 12,191,219 B2
Gas-permeable package lid of chip package structure and manufacturing method thereof
Lung-Tai Chen, Kaohsiung (TW); Chin-Sheng Chang, Tainan (TW); Bor-Shiun Lee, New Taipei (TW); and Chih-Hsiang Ko, Tainan (TW)
Assigned to Industrial Technology Research Institute, Hsinchu (TW)
Filed by Industrial Technology Research Institute, Hsinchu (TW)
Filed on Jan. 19, 2022, as Appl. No. 17/578,447.
Claims priority of application No. 110143324 (TW), filed on Nov. 22, 2021.
Prior Publication US 2023/0163034 A1, May 25, 2023
Int. Cl. H01L 23/06 (2006.01)
CPC H01L 23/06 (2013.01) 18 Claims
OG exemplary drawing
 
1. A gas-permeable package lid of a chip package structure, applied to a chip package structure, comprising:
a lid body, integrally formed;
a through hole, penetrating the lid body; and
a hydrophobic gas-permeable membrane, bonded to the lid body and shielding the through hole, wherein a part of the hydrophobic gas-permeable membrane is embedded in the lid body,
wherein the hydrophobic gas-permeable membrane comprises a membrane body and a plurality of positioning holes penetrating the membrane body, and the positioning holes are embedded in the lid body.