US 12,191,218 B2
Semiconductor device including surface pressure absorbing member for fastening heat sink
Arata Iizuka, Tokyo (JP); and Korehide Okamoto, Fukuoka (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 16/754,992
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Nov. 22, 2017, PCT No. PCT/JP2017/041950
§ 371(c)(1), (2) Date Apr. 9, 2020,
PCT Pub. No. WO2019/102537, PCT Pub. Date May 31, 2019.
Prior Publication US 2021/0202330 A1, Jul. 1, 2021
Int. Cl. H01L 23/049 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/049 (2013.01) [H01L 23/3672 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor element;
a heat sink on which the semiconductor element is mounted;
a case made of resin, the case being mounted on the heat sink and containing the semiconductor element; and
a fastening hole passing through the case and the heat sink,
wherein
a surface pressure absorbing member is at least partially embedded in the case and positioned at portion including the fastening hole in plan view, the surface pressure absorbing member having a substantially flat plate shape and being higher in rigidity than the resin.