US 12,191,214 B2
System and methods for controlling an amount of primer in a primer application gas
Pei-Yi Su, Taichung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Sep. 8, 2021, as Appl. No. 17/469,191.
Claims priority of provisional application 63/157,049, filed on Mar. 5, 2021.
Prior Publication US 2022/0285230 A1, Sep. 8, 2022
Int. Cl. H01L 21/66 (2006.01); H01L 21/67 (2006.01)
CPC H01L 22/20 (2013.01) [H01L 21/67253 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for controlling an amount of primer in a primer application gas, comprising:
a first sensor for detecting a first content in the primer application gas that is fed into a wafer priming chamber, wherein the primer is applied to a semiconductor wafer in the wafer priming chamber;
a second sensor for detecting a second content in an exhaust gas that is exhausted from the wafer priming chamber; and
a flow control device that determines an extent of reaction of the primer in the wafer priming chamber based on a first sensor signal from the first sensor and a second sensor signal from the second sensor, and controls the amount of primer in the primer application gas based on the extent of reaction so as to maintain a stable concentration of primer in the wafer priming chamber.