US 12,191,190 B2
Substrate processing chamber, substrate processing system including the same, and substrate processing method using the same
Yongmyung Jun, Hwaseong-si (KR); Hyunjin Ko, Hwaseong-si (KR); Seohyun Kim, Hwaseong-si (KR); Jae Seong Ryu, Hwaseong-si (KR); Inkwang Bae, Hwaseong-si (KR); and Seungbu Baek, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 5, 2022, as Appl. No. 17/737,490.
Claims priority of application No. 10-2021-0101884 (KR), filed on Aug. 3, 2021.
Prior Publication US 2023/0043451 A1, Feb. 9, 2023
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68742 (2013.01) [H01L 21/67051 (2013.01); H01L 21/67242 (2013.01); H01L 21/68785 (2013.01); H01L 21/67017 (2013.01); H01L 21/67103 (2013.01); H01L 21/6719 (2013.01); H01L 21/67253 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate processing chamber comprising:
a housing providing a process space;
a spin apparatus provided in the housing; and
a fluid spraying nozzle configured to spray fluid into the process space,
wherein the spin apparatus comprises:
a spin chuck configured to support a substrate;
a rotation driving part configured to rotate the spin chuck;
a weight sensor configured to measure a weight of the substrate supported on the spin chuck;
supporting pins provided on the spin chuck, spaced apart from each other along a circumference of the spin chuck, and in contact with a bottom surface of the substrate; and
fastening pins fastening the substrate disposed on the supporting pins.